**Job Id** E1958718
**Job Title** Hardware Field Application Engineer, Tier 2 Cloud Service Providers
**Post Date** 09/13/2017
**Company-Division** Qualcomm Datacenter Technologies, Inc.
Qualcomm Datacenter Technologies, Inc.
**Job Area** Engineering – Customer Engineering
Engineering – Hardware
**Location** California – Bay Area
California – San Jose
California – Santa Clara
**Job Overview** Job duties include (but are not limited to):
Managing the customer technical relationships at architectural, management,and engineering levels. This requires working closely with cloud service provider worldwide sales teams. Develop a strong technical understanding of issues at a total solution level, architectural depth and technical skills to comprehend the rapidly changing software stack, infrastructure needs and ecosystem enabling aspects of server enablement. Establish influential relationships with key decision makers in each discipline in order to uncover new opportunities and trends; apply knowledge of Qualcomm product directions to influence customer decisions. Coordinate and drive customer architectural, engineering, marketing, and product planning groups to remove any technical or barriers to the adoption of qualcomm products. Drive effective customer feedback into Quaclomm roadmap and product planning processes in order to improve current and future product offerings that meet customer needs. This individual will be responsible to lead a matrixed organization that provides technical support for all all aspects of the engagement with the customer from system bring up to design debug at system and silicon level. Looking for an Independent, self driven technical individual who is motivated by new challenges. Must be willing to travel and work at customer sites
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
**Minimum Qualifications** BS/MS in Electrical Engineering or Computer Engineering 5+ years engineering including:
-Experience using server motherboard design based on x86, PowerPC or ARM architectures
-Experience with high speed interfaces: DDR 4, PCIe Gen 3, SATA, USB interfaces
-Experience with low speed interfaces: SPI, I2C, UART, etc
-Experience with high speed signal layout guidelines and issues
-Experience using ICE, Logic analyzer, Scopes, JTGA, TRACE tools for debugging hardware issues -Experience using low-level kernel debuggers
-Experience with platform Software and firmware BIOS, EUFI, Drivers, BMC
-Experience with performance measurements
-Understanding of the cloud customer buying cycles and decision criteria
-Experience managing and prioritizing multiple accounts within a high growth region
-Strong relationships with T2 cloud customers
Must be able to travel up to 25%, including international as needed.
**Preferred Qualifications** – Good team work skills
– Experience and relationship with the OEM, ODM and System integrator ecosystem
– Possess a deep insight into target customers’ roadmap needs and desires, now and into the future, from a technology, pricing and product standpoint.
– Experience leading architectural conversion technical engagements
**Education Requirements** Required: Bachelor’s, Computer Engineering and/or Electrical Engineering
Preferred: Master’s, Computer Engineering and/or Electrical Engineering
**EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.**
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.