IC Package/System Design Engineer
Qualcomm Technologies, Inc. at http://www.qualcomm.com/about/businesses/qct
Engineering – Hardware
California – San Diego
The IC Package Architecture and Design Team at Qualcomm has an opening for Package/System Design Engineer. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for all Qualcomm package products (Digital, RF, Analog, PMIC, etc…).
Job responsibilities for this position include package selection, package design, and package EE modeling. This involves optimizing system co-design of IC-PKG-PCB die keeping in mind package footprint/height constraints, IC floor-planning , PCB ,high-speed signal integrity , power distribution network and thermal constraints. Additional responsibilities:
* IC top level floorplanning including hard macro block placement, padring, RDL and bump pattern/assignment * System level
co-design methodology of IC, Package and PCB/Board
* Concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost
* Package design flow methodology
implementing high speed interface SI constraints for jitter, IR drop, cross-talk, and SSN specs
* Package design flow methodology implementing power distribution network (PDN) constraints for high speed processor cores (1GHz+) including design optimization
techniques at the die/pkg/PCB levels
* Working with marketing/IC/product teams on competitive analysis and road mapping package technology for future products
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
+ Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.
+ 2+ years Hardware Engineering experience or related work experience.
+ Experience in IC package and/or PCB selection , design , and layout experience
+ Experience in Pinmap optimization of optimal PCB design
+ Experience with DDR3/DDR4 layout process
+ Experience or knowledge in PCB design process like Schematic capture
+ Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis
+ Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory
+ Working knowledge of die floor planning, IO placement, andbump placement – Working knowledge of Chip, Package and PCB co-design methodology
+ Familiar with assembly and substrate manufacturing process
+ Familiar with trade-offs among package cost, technologies, design, performance, power, and thermal requirements.
+ Familiar with PCB stack-up and breakout strategy
Required: Bachelor’s, Electrical Engineering and/or Mechanical Engineering or equivalent experience
Preferred: Master’s, Electrical Engineering or equivalent experience
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.