Job Description:

**Job Id** E1960949

**Job Title** Package Design Engineer

**Post Date** 02/21/2018

**Company-Division** Qualcomm Technologies, Inc.

CDMA Technology at http://www.qualcomm.com/about/businesses/qct

**Job Area** Engineering – Hardware

**Location** California – San Diego

**Job Overview** Qualcomm’s Server Package Design Team has a position available to design, model and analyze packages for server applications. The qualified candidate should have knowledge of high performance electrical package design and will work in a team-oriented environment to provide package electrical design expertise in the areas of signal integrity and power distribution for the design of server packages.

This role will interface with Package Technology experts, external analysis groups, Digital Board Designers, IC Designers, Application Engineers, and Reference Platform Design teams to understand their requirements, and signal and power integrity requirements for a server package.

Working effectively across organizational boundaries is essential as is the effective presentation and documentation of results. You will be expected to proactively seek ways to optimize package design, streamline and validate signal and power integrity modeling of your package, including simulation methodologies.

Our candidate creates electrical design guidelines to help layout experts perform an optimized package design for digital interfaces such as DDR3/4, high speed SERDES and high current, high speed processor IP. Bump pattern, pinout, package substrate stack-up and package routing strategy definition are one part of the responsibilities to kick start the layout activity and package modeling and analysis using SI/PI EM and analysis tools are another part of this job to prove that proposed package layout meets all the digital electrical specs. **Responsibilities:**

+ Bump pattern definition, pinout, package substrate stack-up and routing strategy definition

+ Perform package modeling

+ Provide layout design guidelines for digital interfaces

+ Provide to and receive feedback from package technology group, IC and PCB designers

+ Develop scripts for pre- and post-processing automation

+ Create technical documentation and presentations.

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

**Minimum Qualifications** **1+ years industry experience in:**

+ Digital package design focused primarily on signal/power integrity

+ One or more commercial SI tools such as Ansys tools, PowerSI and/or Sentinel-PSI

**Preferred Qualifications** **Experience in the following:**

+ Electromagnetic theory and its application to high-speed transmission lines

+ DDR3/4 and LPDDR3/4 package design and analysis

+ High-speed serial I/O package design and analysis

+ Sigrity, Agilent, and MATLAB tools desirable

+ Ansys HFSS or a similar 3D electromagnetic field solver

**Education Requirements** Required: Bachelor’s, Electrical Engineering and/or Mechanical Engineering

Preferred: Master’s, Electrical Engineering and/or Mechanical Engineering

**EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.**

About Qualcomm

Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.