Overview

Job Description:

**Job Id** E1958803

**Job Title** Package/System/Module Design Lead

**Post Date** 11/16/2017

**Company-Division** Qualcomm Technologies, Inc.

CDMA Technology at http://www.qualcomm.com/about/businesses/qct

**Job Area** Engineering – Hardware

**Location** California – San Jose

**Job Overview** Qualcomms Package Architecture and Design team has an opening for an IC Package Design Lead. This team is responsible for road mapping, architecting, design methodology, design implementation and verification for Qualcomm package products (Digital, RF, Analog, PMIC, etc…) Job responsibilities for this position include package selection & package design. This involves optimizing system co-design of IC-PKG-PCB keeping in mind package footprint/height constraints, IC floor-planning, PCB co design, high-speed signal integrity, power distribution network and thermal constraints.

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

**Minimum Qualifications** 1+ yrs experience in IC package selection , design , electrical simulation experience

Tools/Software:

+ Cadence SiP/APD (including Constraint Manager)

+ EM simulation tool (Ansys Q3D, HFSS or equivalent)

**Preferred Qualifications**

+ Experience in system in package ( SIP ) IC package selection , design , electrical simulation experience

+ Experience in PCB design , and layout experience

+ Experience in Package Pinmap optimization for optimal Package & PCB design

+ Working knowledge of die floor planning, IO placement, and bump placement

+ Experience or knowledge in PCB design process like Schematic capture

+ Experience in IO + PKG + PCB SI/PI modeling, co-simulation and analysis

+ Strong knowledge in 3D/2D EM simulation tool, electromagnetic theory and transmission line theory

+ Working knowledge of Chip, Package and PCB co-design methodology

+ Experience in concept analysis for new product package selection based on requirements for mechanical, thermal and electrical performance with the goal to achieve lowest system level cost

+ High-speed serial I/O package design and analysis

+ Experience with DDR3/DDR4 layout process

**Education Requirements** Required: Bachelor’s, Electrical Engineering and/or Mechanical Engineering

Preferred: Master’s, Electrical Engineering and/or Mechanical Engineering

*LI-SRC

**EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.**

About Qualcomm

Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.