**Job Id** E1960939
**Job Title** Physical Failure Analysis Engineer
**Post Date** 12/18/2017
**Company-Division** Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
**Job Area** Engineering – Verification
**Location** California – San Diego
**Job Overview** Performing structural and physical analysis on Qualcomm products. This would include optical inspection, X-ray examination, cross-sectional analysis using mechanical and ion beam techniques, and sample photography and documentation using optical as well as scanning electron microscope systems. This position also requires ability to perform scanning acoustic Microscope analysis for purpose of IC package inspection.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
+ Knowledge of parallel polish and cross-section analysis technique on IC package and silicon die.
+ Experience with and knowledge of operating Ion beam and scanning electron beam in order to image various package and die deprocessed samples.
+ Knowledge of wet chemical and mechanical deprocessing techniques.
+ Knowledge to perform CSAM analysis.
+ Electronic circuit design and fabrication knowledge.
**Education Requirements** Required: Bachelor’s, Electrical Engineering
**EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.**
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.