RF SIP layout engineer, Senior
Qualcomm Technologies, Inc. at http://www.qualcomm.com/about/businesses/qct
Engineering – Hardware
California – San Diego
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age and this is where you come in.
Join this team focused on RF Front End Modules for the Cellular and Wireless Data markets. You will be part of the Business Unit Engineering organization and work directly with and support multiple product development teams. As a senior technical specialist, you will provide technical leadership in the development of new and sustainable technology platforms for the company.
**Main responsibilities of this job role are:**
+ Mechanical Test Vehicle Design, to support product qualification and FE/BE technology development
+ SIP/Layout support for product tape out.
+ Cadence SiP layout Symbol Generation/validation. Deployment and maintenance of Symbol libraries/database
+ Generating and maintain product mechanical documentation/application note for RFFE Modules
+ Provide ongoing SIP training/mentoring for internal engineer team
+ Coordinating DRC review with suppliers and design engineers for design for manufacture
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
+ Bachelor’s degree in Science, Engineering, or related field.
+ 2+ years ASIC design, verification, or related work experience.
+ 5 Years minimum RF + System level PCB/IC Substrate layout experience using industry standard tool set. Cadence layout tools preferred.
+ Working knowledge of substrate stack-up to achieve design objectives
+ Working knowledge of layout techniques for pwr/gnd distribution, EMI shielding and controlled impedance
+ Working knowledge of different assembly technologies: SMD, Flip Chip, QFN, Through Hole
+ Understanding of substrate manufacturing tolerances
+ Proven track record of product and test vehicle substrate design, including board/chip level Daisy chain TV, substrate electric TV etc.
+ Proven track record of component library development. Footprint/Symbol generation and management of database libraries and/or online distribution of CAD library
+ Proven track record of mechanical design and drawing generation for electronic packaging. Good understanding of geometric dimensioning and tolerancing.
+ Understanding of substrate manufacturing processes and how they impact substrate design (cost, performance)
+ Ability to train and mentor less experienced design engineers
+ Familiarity with common CAD formats (Gerber, DXF, GDS, IDS, STEP) and conversion methods to facilitate data transfer between engineering teams/tool sets
Required: Bachelor’s, Electrical Engineering and/or Mechanical Engineering
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.