**Job Id** E1961285
**Job Title** RFFE Module Design Engineer
**Post Date** 01/03/2018
**Company-Division** Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
**Job Area** Engineering – Hardware
**Location** Florida – Maitland
**Job Overview** In this role you will work in Qualcomm’s RF Front-End (RFFE) Department working on advanced front-end modules for cellular/wireless applications. The position offers the opportunity to design advanced RF Front-End Modules to ensure design success and market leadership. Qualcomm solutions include highly customized LNAs, PAs, FEMs, antenna tuner and multi-throw switches in standalone and module packages for 4G and 5G wireless cell phone and ultra-mobile devices. The RF SiP Design Engineer will deliver Front-End Module designs in a fast-paced team environment, and is required to work closely with RF IC design engineers to optimize a design by extensive co-simulation and co-design based on RF system knowledge.
The responsibilities will include but not be limited to the following:
Multilayer laminate design and layout and simulation
IC integration into multilayer laminates
Solve complex RF technical issues with techniques developed in Qualcomm
Participating and conducting design reviews
Performing lab correlation with Module E2E (End to End) simulation
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
**Minimum Qualifications** 3+ years of experience in the following areas is required:
Usage of quasi-static and full wave EM field solvers (such as Q3D, HFSS,) and circuit simulator like ADS, Virtuoso and plus sufficient programing skill with Matlab
Experience with Power amplifier, tuner, LNA, filters and switch knowledge is a plus.
Experience with RF fundamentals such as Smith chart and impedance matching
**Preferred Qualifications** Measurement of microwave active and passive devices
Usage of test equipment such as VNA/PNA/PXA and high-speed oscilloscope, micro-probes and different calibration methods
RFIC packaging and module design techniques such as PoP, QFN, BGA, LGA, CSP and WLP.
Innovative problem solver, passion to win/contribute, ability to work in, and thrive in, a team environment
**Education Requirements** Required: Master’s, Electrical Engineering
Preferred: Doctorate, Electrical Engineering
**EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.**
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.