Senior Engineer – SIP/Module Packaging Engineering
Qualcomm Technologies, Inc. at http://www.qualcomm.com/about/businesses/qct
Engineering – Hardware
oQualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers, internal design and product teams. Team is looking for experienced packaging engineer who has worked with various packaging technologies Flipchip, Wirebond, CSP, WLP, PoP, etc. Some SIP and integration lead experience will be a plus.
oResponsible from exploring, defining business justification, development and HVM deployment of SiP (System in Package) Module packaging technologies.
oResponsible for defining package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable SIP/Module products.
oInterface with OSATs and substrate suppliers in developing technology related to SiP product requirements. Align with internal product teams.
oWork with internal design team and drive DFM methodology for new technologies.
oWork with internal design, modeling and procurement teams to implement technically best and lowest cost SIP options.
oTechnical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
+ Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.
+ 2+ years Hardware Engineering experience or related work experience.
+ years Hardware Engineering experience or related work experience.
+ years experience with semiconductor packaging, SIP/Module packaging, manufacturing process experience in – Wafer bumping, wafer handling, flipchip, wirebond, Underfill, Molding, SMT and other semiconductor packaging technologies.
+ years experience working , working with OSATs, suppliers, internal design and product teams.
+ years experience with in new product development in electronic packaging, exposure to – design and characterization techniques, DFM methodology, design of experiments and statistical data analysis.
Required: Bachelor’s, Electrical Engineering and/or Industrial & Prod Engineering and/or Materials Science and/or Mechanical Engineering and/or Chemical Engineering
Preferred: Master’s or PhD, Electrical Engineering and/or Industrial & Prod Engineering and/or Materials Science and/or Mechanical Engineering and/or Chemical Engineering
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.