Senior Engineer – SIP/Module Packaging Engineering

Overview

Job Description:

**Job Id**

E1981687

Job Title

Senior Engineer – SIP/Module Packaging Engineering

Post Date

03/12/2020

Company

Qualcomm Technologies, Inc. at http://www.qualcomm.com/about/businesses/qct

Job Area

Engineering – Hardware

Location

United States

Job Overview

Overview

oQualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets. This team is responsible for road mapping, working with OSATs, suppliers, internal design and product teams. Team is looking for experienced packaging engineer who has worked with various packaging technologies Flipchip, Wirebond, CSP, WLP, PoP, etc. Some SIP and integration lead experience will be a plus.

Responsibilities:

oResponsible from exploring, defining business justification, development and HVM deployment of SiP (System in Package) Module packaging technologies.

oResponsible for defining package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable SIP/Module products.

oInterface with OSATs and substrate suppliers in developing technology related to SiP product requirements. Align with internal product teams.

oWork with internal design team and drive DFM methodology for new technologies.

oWork with internal design, modeling and procurement teams to implement technically best and lowest cost SIP options.

oTechnical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

Minimum Qualifications

+ Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.

+ 2+ years Hardware Engineering experience or related work experience.

Preferred Qualifications

+ years Hardware Engineering experience or related work experience.

+ years experience with semiconductor packaging, SIP/Module packaging, manufacturing process experience in – Wafer bumping, wafer handling, flipchip, wirebond, Underfill, Molding, SMT and other semiconductor packaging technologies.

+ years experience working , working with OSATs, suppliers, internal design and product teams.

+ years experience with in new product development in electronic packaging, exposure to – design and characterization techniques, DFM methodology, design of experiments and statistical data analysis.

Education Requirements

Required: Bachelor’s, Electrical Engineering and/or Industrial & Prod Engineering and/or Materials Science and/or Mechanical Engineering and/or Chemical Engineering

Preferred: Master’s or PhD, Electrical Engineering and/or Industrial & Prod Engineering and/or Materials Science and/or Mechanical Engineering and/or Chemical Engineering

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.