Senior Engineer – SIP (System in Packaging) Substrate
Qualcomm Technologies, Inc. at http://www.qualcomm.com/about/businesses/qct
Engineering – Hardware
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age and this is where you come in.
Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets as IoT, Automotive, 5G. This team is responsible for road-map, working with OSATs, suppliers, internal design and product teams as well as NPI. Team is looking for experienced packaging substrate engineer who has worked on substrate technologies.
+ Responsible from exploring, defining business justification, development and HVM deployment of SiP (System in Package) Module packaging technologies.
+ Responsible for defining package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable SIP/Module products.
+ Interface with OSATs and substrate suppliers in developing technology related to SiP product requirements. Align with internal product teams.
+ Work with internal design team and drive DFM methodology for new technologies.
+ Work with internal design, modeling and procurement teams to implement technically best and lowest cost SIP options.
+ Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
+ Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.
+ Master’s in Mechanical Engineering/Materials Science/Electrical Engineering/Chemical Engineering
+ 3 – 10 yrs of experience working in a semiconductor packaging environment for consumer products.
+ Experience of Technical program management to plan, execute, and monitor complex process or product developments.
+ Understanding of organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
+ Knowledge in DOE , Control Plan , FMEA and other statistical Process control method.
+ Good oral and written communication skills, strong team player & project management skills.
+ 10 years of experience in the development and high-volume manufacturing of IC substrate and Rigid flex PCB.
+ Experience in substrate process integration
+ Understanding of semiconductor package manufacturing process – Substrate manufacturing, SIP/modules, wafer bumping, wafer handling, flip-chip, wire-bond, Underfill, Molding, SMT and other packaging technologies.
+ Hands on experience at the substrate manufacturing factory, or substrate material factory
+ Understanding industry packaging trends, end-user packaging considerations, and previous experience with high-end mobile consumer products.
+ Proficiency in material and characterization data analysis, and statistical data analysis.
+ Knowledge of reliability test methods and qualification procedure.
+ Six Sigma Green or Black belt a plus
Required: Bachelor’s, Electrical Engineering and/or Materials Science and/or Mechanical Engineering or equivalent experience
Preferred: Master’s, Electrical Engineering and/or Materials Science and/or Mechanical Engineering or equivalent experience
EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.