Senior RFFE module design engineer

Overview

Job Description:

**Job Id**

E1981002

Job Title

Senior RFFE module design engineer

Post Date

04/02/2020

Company

Qualcomm Technologies, Inc. at http://www.qualcomm.com/about/businesses/qct

Job Area

Engineering – Hardware

Location

Massachusetts – Boxborough

Job Overview

Qualcomm is looking for a Power Amplifier Module Designer to join our Qualcomm Front-end Team (QFE) to participate in the development for emerging mobile wireless applications. Join this growing team to develop a highly integrated and innovative multi-mode/multi-band power amplifier in emerging worldwide wireless standards such as UMTS, LTE and 5G NR. Work in a team environment developing highly integrated RF power amplifier modules for high volume production.

Responsibilities include substrate laminate design, integrated circuit design, and RF test and verification. The position will interface with core teams in San Diego to improve yield and reliability during product launch. Design tools such as Agilent ADS, Cadence, HFSS, SiP, will be used for design. As part of the team, responsible for all aspects of circuit design and product development, feedback on specification and customer interaction.

All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.

Minimum Qualifications

+ Bachelors in Electrical Engineering

Preferred Qualifications

+ ADS and HFSS EM simulation experience

+ HBT IC design experience

+ PA performance optimization on engineering benches

Education Requirements

Required: Bachelor’s, Electrical Engineering or equivalent experience

Preferred: Master’s, Electrical Engineering

EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.