**Job Id** E1959532
**Job Title** Senior/Staff ASIC Engineer – SIP (System in Packaging) Substrate & Assembly
**Post Date** 10/13/2017
**Company-Division** Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
**Job Area** Engineering – Hardware
**Location** California – San Diego
**Job Overview** The Qualcomm Packaging group is responsible for developing new package technologies and high volume manufacturing deployment for different product segments for mobile market & new emerging markets as IoT, Automotive, 5G. This team is responsible for road mapping, working with OSATs, suppliers, internal design and product teams as well as NPI. The team is looking for an experienced packaging engineer who has worked with various packaging technologies Flipchip, Wirebond, CSP, WLP, PoP, SIP/Module packages SIP/Module and integration lead experience will be a plus.
+ Responsible from exploring, defining business justification, development and HVM deployment of SiP (System in Package) Module packaging technologies from substrate manufacturing to assembly
+ Responsible for defining package process flow, material set, test vehicle, DOEs, process control plans to successfully develop manufacturable and reliable SIP/Module products.
+ Interface with substrate suppliers, OSATs and material suppliers in developing technology related to SiP product requirements. Align with internal product teams.
+ Work with internal design team and drive DFM methodology for new technologies, modeling and procurement teams to implement technically best and lowest cost SIP options.
+ Technical program management to plan, execute, and monitor complex process or product developments. Regular updates on program status to management.
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
+ 3 + yrs of experience working in a fast-paced semiconductor packaging environment for consumer products.
+ Minimum 1 yrs of experience in working with outside suppliers/partners.
+ Process integration experience in taking semiconductor packaging products from development to HVM.
+ Manufacturing process experience in – Substrate manufacturing, SIP/modules, wafer bumping, wafer handling, flipchip, wirebond, Underfill, Molding, SMT and other packaging technologies.
+ Experience with organic laminate manufacturing, role of packaging on product electrical & thermal performance, JEDEC standard component & board level reliability testing.
+ Knowledge in DOE , Control Plan , FMEA and other statistical Process control method.
+ Good oral communication, strong team player & project management skills.
+ Knowledge of AutoCAD, JMP and MS Office.
**Education Requirements** Required: Bachelor’s, Materials Science and/or Mechanical Engineering
Preferred: Master’s, Materials Science and/or Mechanical Engineering
**EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.**
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.