**Job Id** E1958417
**Job Title** Supplier Quality Engineer – Packaging
**Post Date** 10/05/2017
**Company-Division** Qualcomm Technologies, Inc.
CDMA Technology at http://www.qualcomm.com/about/businesses/qct
**Job Area** Engineering – Manufacturing/Quality/Other
**Location** California – San Diego
**Job Overview** The Qualcomm QCT Supplier Quality Engineering (SQE) team is seeking a highly motivated, independent individual with a broad knowledge of RFFE module package assembly / test and engineering principles in a fast paced high tech environment. Support QCT RFFE business unit suppliers including bump, assembly and test suppliers and actively engage San Diego RFFE packaging and product / test Engineering team. The job function includes quality investigation, yield tracking and system development for direct business. Conduct supplier quality assessments for the key subcontractors. Develop monitoring and measurement systems including ongoing SPC data monitoring and reporting while driving for continuous improvement. Work with other cross functional teams to develop and document new processes in support of direct business model. Work with CQE to support related RMA investigations and follow up with suppliers fool proof corrective actions through completion.
+ Support Significant number of NPI products and drive timely quality issues resolutions at suppliers
+ Proactively Initiate Production Review Board to manage production line
+ Engaging with CQE and RFFE Package Engineering for RMAs resolutions
+ Driving cross functional Technical Review Board for supplier fast track Process Changes Notice
+ Translate technical problems into actionable items
+ Drive supplier for Continuous Process Improvement
+ Lead cross functional team to contain and prevent Quality excursion
All Qualcomm employees are expected to actively support diversity on their teams, and in the Company.
+ Minimum 5-7 years RF Module packaging experience with HVM Bump, assembly and Test manufacturing
+ 5-7 years of experience working with major assembly and bump supplier issues and HVM troubleshooting through problem solving
+ Experience translating technical problems into actionable items with experience querying quality database systems to gather information.
+ Extensive Knowledge of latest RFFE module including LGA Substrate, Bump, Assembly and Test processes
+ Experience working with Asia based suppliers on process development and process improvements
+ Analytical and problem solving skills with strong communication and presentation skills dealing in multicultural environments
+ Ability to lead cross-functional teams and apply good problem solving methods
+ Able to interface/communicate with cross-functional (and cross-cultural) teams internally and externally with QCT Asian operations / suppliers
+ Advanced knowledge of statistical tools (i.e. SPC, FMEA, and Gauge R&R)
+ Able to interpret basic metrics for presentations using advanced MS-Excel functions
**Education Requirements** Required: Bachelor’s, Industrial & Prod Engineering and/or Mechanical Engineering
Preferred: Master’s, Industrial & Prod Engineering and/or Mechanical Engineering
**EEO employer: including race, gender, gender identity, sexual orientation, disability & veterans status.**
Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.