Company:Qualcomm Technologies, Inc.
Job Area:Engineering Group, Engineering Group > Hardware Engineering
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.
The Test Engineering group is responsible for the various parts of product lifecycle of integrated SOCs used in mobile, compute applications. We work with global cross functional teams in providing engineering test solutions to drive product to commercialization and high volume production manufacturing. The position offers growth/specialization opportunities within Digital Test Engineering (Mixed Signal, Microprocessors, HSIO, Logic, Memory, DFT, DFM, Machine Learning, SW Development), adjacent disciplines (Yield Management, Diagnostics, Product Engineering). Responsibilities for this position include:• Develop product verification, test and qualification plans, performing silicon verification and characterization on ATE, drive debugs and failure analysis of silicon/test issues, test HW design and development, qualify product/package to specifications, correlate ATE to systems platform and perform data analytics to drive test cost/yield/quality improvements. • Partner and drive all wafer and package level manufacturing activities by working closely with foundry and assembly houses. • Requires collaboration with cross functional teams like Design/DFT/Simulations/SW/Reliability/Process, etc. • Work in a fast paced and dynamic environment and be passionate about delivering quality work.Job DescriptionMinimum Qualifications• Bachelor’s degree in Engineering, Information Systems, Computer Science, or related field.Preferred Qualifications• Master’s Degree in Engineering, Information Systems, Computer Science or related field.• 1+ years Hardware Engineering experience or related work experience.OTP/Fusing background a plus• Basic knowledge in Semiconductor Physics and semiconductor manufacturing process.• Solid understanding of Electronics engineering fundamentals and VLSI concepts, digital, analog, mixed-signal, and power management.• Good understanding of SoC product and package quality/reliability tests (HTOL, ESD, Latch Up, BHAST, etc.).• Familiarity with design for test (DFT) techniques and structural tests such as Scan/ATPG, JTAG, and memory BIST is desirable.• Good ASIC device level characterization skills. System level knowledge is a plus.• Hands on experience with Advantest 93K (ATE – Automated Test Equipment) is a plus.• Hands on experience with data analysis software (JMP, Exensio, etc) is a plus• Basic experience with Python/C++ is a plus.• Ability to work with common test equipment (oscilloscope, spectrum analyzer, time interval analyzer, logic analyzer, network analyzer, etc).• Ability to work independently and with good initiative to overcome technical challenges.• Strong verbal and written communications skills. Able to organize effectively and document work thoroughly while working with local and remote teams.• Prior relevant internship or work experience is a plus.
• Frequently transports between offices, buildings, and campuses up to ½ mile.
• Frequently transports and installs equipment up to 5 lbs.
• Performs required tasks at various heights (e.g., standing or sitting).
• Monitors and utilizes computers and test equipment for more than 6 hours a day.
• Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.
Bachelors – Computer Science, Bachelors – Engineering, Bachelors – Information Systems
1+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, RF tools, etc. ,1+ years experience utilizing schematic capture and circuit simulation software. ,1+ years experience with circuit design (e.g., digital, analog, RF).
Computer Science, DSP Architectures, Electrical Engineering, Optical Systems, Packaging Systems
Applicants: If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr_public_article_view&sysparm_article=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer and supports workforce diversity.
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .
We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—we invent breakthrough technologies that transform how the world connects, computes, and communicates.
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Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.