Company:Qualcomm Technologies, Inc.
Job Area:Engineering Group, Engineering Group > ASICS Engineering
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.
The increasing requirement for high performance devices in both the mobile and compute space requires continuous improvement and innovation in area of power delivery and signal integrity. The Qualcomm Advanced Package Design Team has an opening for a package architecture design engineer with particular expertise in the area of signal integrity and power integrity. This role is focused on innovating for future products. It requires out of the box thinking and using past experience and knowledge to create new solutions that are both evolutionary and in particular, revolutionary. Ability to seek out non-obvious solutions and willingness to buck well established trends are particularly desirable. Past experience should include work on actual package designs with understanding of how package process rules can introduce limitations in designing for power and signal integrity. The candidate should have hands on experience in PDN and SI analysis using the industry standard EM simulation tools – experience with varied tools preferred. The candidate is expected to work with package designers, electrical analysis engineers, process engineers as well as architecture and chip design teams across multiple organizations within Qualcomm. The role will include a mixture of PathFinding, electrical analyses, test package/chip designs, product designs (i.e. bringing new concepts all the way to production), presentation, documentation etc.Package performance must be analyzed and understood on the system level. For that reason, particular preference is given to the candidate who demonstrates broad knowledge and experience that expands beyond just packaging to other areas including PCB and phone designs, as well as basic knowledge of IC chip design. Additional Requirements:• Master’s or PhD degree in Electrical Engineering or equivalent experience• 4+ years of experience in SI/PI in Package Design related to mobile or compute designs• Experience in Electromagnetics and solid background on transmission line theory & Crosstalk • Proficiency in field solvers such as Ansys tools (HFSS, SIwave, Q3D), Cadence and similar tools • Experience in simulation tools such as ADS and Hspice • Hands on experience in package design using Cadence Allegro/APD/Sip or Mentor Xpedition• Experience in multi-chip packages, SiPs (System in Package) and modules• Experience in programming or scripting language (Perl/Python) is a plus• Experience in electrical analysis of end-to-end systems including PCB, package and IC• Experience in recent PDN trends: e.g. IPD caps• Experience with split die, 2.5D and 3D designs• Experience demonstrating a pattern of innovation in past projectsKeywords: Signal Integrity, Power Integrity, SIPI, PDN, package, design, co-design
+ Frequently transports between offices, buildings, and campuses up to ½ mile.
+ Frequently transports and installs equipment up to 5 lbs.
+ Performs required tasks at various heights (e.g., standing or sitting).
+ Monitors and utilizes computers and test equipment for more than 6 hours a day.
+ Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.
Bachelors – Engineering, Bachelors – Science
5+ years ASIC design, verification, or related work experience.
Bachelors – Computer Engineering, Bachelors – Computer Science, Bachelors – Electrical Engineering
1+ years of work experience in a role requiring interaction with senior leadership (e.g., Director level and above). ,2+ years experience with design verification methods. ,2+ years experience with scripting tools and programming languages. ,2+ years experience with architecture and design tools. ,8+ years ASIC design, verification, or related work experience.
ASIC Verification, Matlab C, Multicore System-On-Chip (SoC), Perl Programming, Simulation Software
Applicants: If you are an individual with a disability and need an accommodation during the application/hiring process, please call Qualcomm’s toll-free number found here (https://qualcomm.service-now.com/hrpublic?id=hr_public_article_view&sysparm_article=KB0039028) for assistance. Qualcomm will provide reasonable accommodations, upon request, to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. Qualcomm is an equal opportunity employer and supports workforce diversity.
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EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification.
If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .
We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—we invent breakthrough technologies that transform how the world connects, computes, and communicates.
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Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.