Company:Qualcomm Technologies, Inc.
Job Area:Engineering Group, Engineering Group > ASICS Engineering
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in.
Qualcomm is a company of inventors that unlocked 5G ushering in an age of rapid acceleration in connectivity and new possibilities that will transform industries, create jobs, and enrich lives. But this is just the beginning. It takes inventive minds with diverse skills, backgrounds, and cultures to transform 5Gs potential into world-changing technologies and products. This is the Invention Age – and this is where you come in. The IC Package Architecture and Design Team at Qualcomm has an opening for a senior/staff level position to design 5G RF-transceiver package in the package Architecture and Design group.Job Responsibilities- Design and layout 5G RF- transceiver packages by partnering with IC teams and release them for manufacturing – Extract HFSS package 3D parasitic models for various RF packages ( TX/ LNA, mixer , XO) in ANSYS Electronic Desk Suite, HFSS/3D Layout/Q3D/SiWave- Do post simulation data processing and analysis to help optimize package design, doing layout changes to optimize different electrical parameters (Coupling, IL, RL)- Propose and define strategy for different 5G transceiver package design options optimizing for cost/form-factor and performance
+ Master’s/ Ph.D degree in Science, Engineering, or related field.
+ Good understanding of Electromagnetic (EM) package modeling package modeling and simulation experience for various RF IPs ( TX/RX/Mixers etc)
+ Good understanding of different IP sub-blocks in a RF IC
+ Experience of various package technology tradeoffs ( FC/WB etc)
+ Familiar with PCB design and or stackup and breakout constraints
+ Experience in schematic capture, layout and design using Cadence Allegro/Mentor Schematic Design – Entry (Concept HDL) design tools is a plus
+ Familiar with Virtuoso schematic and layout design
+ Frequently transports between offices, buildings, and campuses up to ½ mile.
+ Frequently transports and installs equipment up to 5 lbs.
+ Performs required tasks at various heights (e.g., standing or sitting).
+ Monitors and utilizes computers and test equipment for more than 6 hours a day.
+ Continuous communication which includes the comprehension of information with colleagues, customers, and vendors both in person and remotely.
Bachelors – Engineering, Bachelors – Science
2+ years ASIC design, verification, or related work experience.
Bachelors – Computer Engineering, Bachelors – Computer Science, Bachelors – Electrical Engineering
2+ years experience with design verification methods. ,4+ years ASIC design, verification, or related work experience. ,2+ years experience with architecture and design tools. ,2+ years experience with scripting tools and programming languages.
ASIC Verification, Matlab C, Multicore System-On-Chip (SoC), Perl Programming, Simulation Software
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If you would like more information about this role, please contact Qualcomm Careers (http://www.qualcomm.com/contact/corporate) .
We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—we invent breakthrough technologies that transform how the world connects, computes, and communicates.
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Who is Qualcomm, and what do we do? We are engineers, scientists and business strategists. We are from many different countries and speak many different languages. We come from diverse cultures and have unique perspectives. Together, we focus on a single goal—invent mobile technology breakthroughs.